Tejinder Singh

Tejinder Singh


Dell Technologies and University of Waterloo

ON, Canada


  • Affiliate Member, TC-13 MICROWAVE CONTROL TECHNIQUES, Technical Committees**
  • Electronic Newsletter Editor, Electronic Information Committee, Standing Committees**
  • Graphic Design/Newsletters, Electronic Information Committee, Standing Committees**
  • Member, TC-6 RF MEMS AND MICROWAVE ACOUSTICS, Technical Committees**
  • Members, Subcommittee: Social Media, Electronic Information Committee, Standing Committees**
  • MTT-S Newsletter, Subcommittee: Marketing, Branding and Communications, Marketing and Communications Committee, Standing Committees**


Tejinder Singh (Senior Member, IEEE) received the Ph.D. degree (with highest academic honor) in electrical and computer engineering from the University of Waterloo, ON, Canada, in 2020.

He is a Principal Member of Technical Staff with the Advanced Wireless Technology R&D Group, Office of the CTO, Dell Technologies, Ottawa, ON, Canada and an Adjunct Professor at the University of Waterloo. He was a Postdoctoral Fellow at NASA Jet Propulsion Laboratory (JPL), California Institute of Technology (Caltech), Pasadena, CA, USA from 2020-21 and a Research Assistant Professor at the University of Waterloo from 2020-22. He has authored or coauthored several research publications in the areas of phase-change materials (PCMs), microelectromechanical systems (MEMS), low temperature superconducting (LTS) quantum devices, and reconfigurable intelligent surfaces (RIS) for B5G/6G applications.

Dr. Singh is a recipient of the Governor General’s Gold Medal, one of the highest Canadian honors for his academic excellence and outstanding doctoral research. He has received highly competitive and prestigious federal awards from the Govt. of Canada including Vanier Canada Scholarship from 2017-20 and the NSERC Postdoctoral Fellowship from 2020-22. He also received the competitive Waterloo Institute for Nanotechnology (WIN) Nanofellowship (twice) in 2017-18. His research contributions have bestowed numerous accolades including the Brian L. Barge Microsystems Integration Award from Canada Microsystems (CMC) in 2019, the Young Engineer Award from the European Microwave Association (EuMA) in 2021, and more than 10 Best Paper Awards at several prestigious international conferences. He is currently serving as an Associate Editor for the IEEE Transactions on Microwave Theory and Techniques, and Microsystem Technologies (Springer- Nature), Editor for the IEEE MTT-S Newsletters, and Technical Paper Review Committee (TPRC) Member of the IEEE MTT-S International Microwave Symposium (IMS).

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