Rick Sturdivant



Microwave Packaging Technology, Inc. 1275 North Tustin Ave. Anaheim CA 92807


Rick Sturdivant is President of Microwave Products and Technology, Inc (mptcorp.com (link is external)) which develops products and technology supporting T/R modules and phased arrays for commercial and military systems. He has over 26 years of experience developing products for microwave and millimeter-wave applications. His experience includes high volume telecom modules, point to point radio systems, modules for radar receiver exciters, and T/R modules and subsystems for active electronically scanned arrays. He was instrumental in developing the world’s first tile array T/R modules for which he received the Engineering Excellence Award from Hughes Aircraft Company. He holds 6 US Patents and has published over 23 articles on microwave and millimeter-wave circuits. He is author of the books Transmit Receive Modules for Radar and Communication Systems (Artech House, 2015), Hands on Guide to Heat Transfer for Microwave and Millimeter-wave Electronics (eBook: Amazon.com, 2015), Microwave and Millimeter-wave Electronic Packaging (Artech House, 2013), and Chapter 1 of the book RF and Microwave Electronic Packaging (Springer Publishing, 2010). He earned a M.S.E.E. from UCLA, a B.S.E.E. from CSULB, and a B.A. from Vanguard University.


T/R Modules Using 3D and SIP Packaging

T/R modules have traditionally used metal housings with glassed-in interconnects and ceramic substrates. More recent approaches use 3D stacked substrates and the tile module approach. This approach resulted in lower cost, lower-profile and lighter-weight arrays. With advances in packaging materials and processes, System In a Package (SIP) approaches are being used for T/R modules. These approaches promise the realization of further cost reductions, large “membrane” arrays for space applications and improved array-level manufacturability. This presentation reviews traditional T/R module packaging, examines a tile module in detail, examines next generation T/R modules using SIP and array-level packaging approaches. The presentation concludes with a projection on future developments in phased arrays.

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