Quan Xue

Quan Xue


South China University of Technology

Guangzhou, Guangdong China


  • 2010 - 2013, Transactions Past Associate Editors, MTT Transactions, Publications**


Professor Xue began his professional career in the Universisty of Electronic Science and Technology of China (UESTC) in 1993 as a Lecturer, immidately after he obtained his Ph.D. In 1997, he became a Professor in UESTC then moved to Chinese University of Hong Kong to work as a Research Associate and then a Research Fellow. In 1999, he joined the City University of Hong Kong as Senior Scientific Officer, and then promoted as Assciate Professor, Professor, and Chair Professor of Microwave Engineering. He also served the University as the Associate Vice President, the Director of Information and Communication Technology Center, and the Deputy Director of the State Key Lab of Millimeter Waves (Hong Kong). In 2017, he joined South China University of Technology. Now he is a Professor and serves as the Dean of the School of Electronics and Information Engineering, the Dean of the School of Microelectronics, and the Director of the Guangdong Key Laboratory of Terahertz and Millimeter Waves. He also serves as the Chief Scientist of Antenna in the 2012 Labs of Huawei Technologies. His is a member of Chinese National 6G Technology General Expert Group. He has published over 400 internationally refereed journal papers and over 150 international conference papers. In addition, he has held more than 50 Chinese patents and more than 30 granted US patents. Prof. XUE’s research interests include microwave/millimeter-wave/THz passive components, active components, antenna, microwave monolithic integrated circuits, etc.


Millimeter-wave Transceiver Chips with Antenna in Package

The increasing high requirements of wireless communications and sensors are making research and commercialization of millimeter-wave integrated circuits and antennas experience tremendous growth. The advancement of modern CMOS technology facilitates it to become the prevailing technology to achieve low-cost and highly-integrated millimeter-wave integrated circuits. Meanwhile, the compound semiconductor is still a must for low noise and high power millimeter-wave system. As the operating frequency enters the millimeter-wave regime, the circuit component’s size becomes comparable to the electromagnetic wave wavelength. Therefore, a mixed design methodology using both the lumped and distributed elements in the millimeter-wave integrated circuit design is of great interest, not only compound semiconductor but also CMOS integrated circuits. On one hand, to achieve high-integration and high-pwerformance, the heterogeneous packaging architecture to combined the merits of both CMOS and compound semiconductor millimeter-wave integrated circits is becoming an attractive technology. On the other hand, considering the efficiency, cost, and integration of advanced wireless systems, discrete antenna is no longer suitable for millimeter-wave wireless systems. Therefore, antenna-in-package (AiP) has become the mainstream for millimeter-wave system, which implements an antenna or antennas on (or in) package of chips leading to a high efficiency and highly-integrated radio. In the talk, innovative design approaches and methodologies on millimeter-wave integrated circuits´╝îsubsystems and corresponding antenna-in-package will be introduced.

The 10-minute preview video:

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