Chenhao Chu

Chenhao Chu


ETH Zürich

Zurich, Switzerland


  • Members, Subcommittee: Social Media, Electronic Information Committee, Standing Committees**
  • Website Updates, Electronic Information Committee, Standing Committees**


Chenhao Chu received the M.S. degree (Hons.) in electronic information engineering from City University of Hong Kong (CityU), Hong Kong, China, in 2017, and the Ph.D. degree in electronic engineering from University College Dublin (UCD), Dublin, Ireland, in 2022. He is currently a postdoctoral research fellow at Department of Information Technology and Electrical Engineering (D-ITET) of Swiss Federal Institute of Technology Zürich (ETH Zürich), Zurich, Switzerland. His research interests include broadband high-efficiency power amplifiers/transmitters at RF/mm-Wave, MMIC power amplifier design for RF/mm-wave applications, and antenna-in-package (AiP) for phased arrays. From October 2017 to September 2018, he was a Research Assistant with the State Key Laboratory of Millimeter Waves, Department of Electronic Engineering, CityU.

Dr. Chu is a member of Social Media Subcommittee in Electronic Information Committee of IEEE Microwave Theory and Technology Society (MTT-S). He has won three prizes in MTT-S High Efficiency Power Amplifier Student Design Competitions (HEPA-SDCs), i.e., 2nd Place at the 2021 International Microwave Symposium (IMS2021), 1st Place for both ACPR-FoM and EVM FoM at 2022 Radio and Wireless Week (RWW2022), and 3rd Place at IMS2022. He was also on the final list of the Student Paper Competition at RWW2022 and the Three-Minute Thesis Competition (3MT) at IMS2022. Dr. Chu was also a recipient of the Best Student Paper Award (First Place) of the 19th Royal Irish Academy/the International Union of Radio Science (RIA/URSI) Research Colloquium on Radio Science and Communications in October 2022. He is a Reviewer of journals, including IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Circuits and Systems-I: Regular Papers, IEEE Microwave and Wireless Technology Letters, and IEEE Microwave Magazine.

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